MSC SM2S-EL

Intel® Atom™ x6000 / Pentium® / Celeron® N and J Series SOC

The new MSC SM2S-EL module features Intel's next-generation low-power, multi-core system-on-chip (SOC) Atom generation (codenamed "Elkhart Lake"). Built on 10nm process technology the SoC integrates the next generation Intel Atom processor core architecture and graphics accelerators, memory controller and rich I/O functionality into a single package. The module is designed for extended temperature range and 24/7 operation making it an ideal platform for mission critical tasks that require a reliable and performant compute base. It provides significant performance gains over previous Atom generations allowing for technology upgrades within existing power and cooling requirements defined by the system design.

The new MSC SM2S-EL offers triple independent display support with a maximum of 4k resolution, DirectX 12, fast LPDDR4 memory with up to 16GB and optional IBECC capabilities, fast UFS 2.0, USB 3.1 and PCIe Gen3 on a power saving and cost-efficient SMARC 2.1 Short Size module.

Different SOCs with dual- and quad-core processors are supported by this design. In addition to an extensive set of interfaces and features, the MSC SM2S-EL offers 2 Gigabit Ethernet with Time-Sensitive Networking (TSN) and 2 CAN-FD interfaces.

For evaluation and design-in of the MSC SM2S-EL module, MSC provides a suitable SMARC 2.1 development platform. A complete, ready-to-run Starterkit is also available.

Intel Atom x6xxxRE, Real-time Embedded SKU´s, dual/quad-core (6W-12W)

Intel Atom x6xxxE, Embeddded SKU´s, dual/quad-core (6W-12W)

Intel Pentium/Celeron J64xx, PC Client SKU´s,quad-core (6W-12W)

Intel Pentium/Celeron N6xxx, PC Client SKU´s, dual/quad-core (6W-12W)

Integrated Intel UHD Graphics (Gen11)

Up to 16GB LPDDR4 SDRAM with IBECC (only Atom SKU´s)

Up to 256GB UFS 2.0 Flash (optional)

SATA-III interface (6Gbps)

1x DisplayPort 1.4 / HDMI™ 2.0b

1x DisplayPort 1.4

LVDS / Embedded DisplayPort and MIPI-DSI

Triple Independent Display support

DirectX, OpenGL 4.5, OpenCL 1.2, Vulkan v1.1

Up to 4x PCI Express x1/x2/x4 Gen. 3

2x USB 3.1 Host interfaces

5x USB 2.0 Host interfaces

1x USB 2.0 Host/Device interface

2x Gigabit Ethernet with TSN/TCC

1x SGMII Interface on PCIE-D (optional)

UART, SPI, I2C, SMBus

2x CAN-FD

HD/I2S Audio, SD Card interface

Trusted Platform Module (optional)

SMARC 2.1 compliant

UEFI Firmware

Technical Data - MSC SM2S-EL

Technology x86
FormFactor SMARC™ Short Size
CPU

Intel Atom x6425RE Processor, quad-core 1.9GHz, 32EU, TCC, IBECC, 12W, IUC
Intel Atom x6414RE Processor, quad-core 1.5GHz, 16EU, TCC, IBECC, 9W, IUC
Intel Atom x6212RE Processor, dual-core 1.2GHz, 16EU, TCC, IBECC, 6W, IUC
Intel Atom x6425E Processor, quad-core 1.8/3.0GHz, 32EU, IBECC, 12W, EUC
Intel Atom x6413E Processor, quad-core 1.5/3.0GHz, 16EU, IBECC, 9W, EUC
Intel Atom x6211E Processor, dual-core 1.2/3.0GHz, 16EU, IBECC, 6W, EUC
Intel Pentium J6425 Processor, quad-core 1.8/3.0GHz, 32EU, 10W, PUC
Intel Pentium N6415 Processor, quad-core 1.2/3.0GHz, 16EU, 6W, PUC
Intel Celeron J6413 Processor, quad-core 1.8/3.0GHz, 16EU, 10W, PUC
Intel Celeron N6211 Processor, quad-core 1.2/3.0GHz, 16EU, 6W, PUC
Intel® Technologies:
Enhanced Intel® SpeedStep® Technology
Intel® Virtualization Technology (VTx-2, VT-d)
Intel® Trusted Execution Engine (TXE)
Intel® Time Coordinated Computing (TCC)
Precision Time Measurement (PTM)
Precision Time Measurement (PTP)
IUC - Intel Industrial Use Conditions
EUC - Intel Embedded Use Conditions
PUC - Intel PC Client Use Conditions

Chipset

Integrated in SOC

RAM

Up to 16GB 3200MT/s LPDDR4 SDRAM, IBECC (only Atom SKU´s), soldered

Flash

Up to 256GB UFS 2.0 Flash (optional)

Storage Interfaces

1x SATA-III 6Gbps
1x SD 3.01/SDIO 3.0

USB

5x USB 2.0 Host interfaces
1x USB 2.0 Host/Device interface
2x USB 3.1 Host interfaces (consumes 2x USB 2.0 if used)

Serial Interfaces

4x UART (two with handshake)

Bus Interfaces

Up to 4x PCI-Express x1 Gen. 3 lanes
1x I2C Bus
2x SPI Bus (Boot/SIO)
1x SMBus
2x CAN-FD (Flexible Data-Rate)

Display Controller

Integrated Intel UHD Graphics (Gen11)
Up to 32 execution units (EU)
3D Acceleration: DirectX, OpenGL 4.5, OpenCL 1.2, Vulkan 1.0
Video Decode: MPEG-2, H.265/HEVC (L5.1), H.264, (L5.2), VC-1, WMV9, VP8,
VP9, MVC, JPEG/MJPEG

Display Interfaces

Three independent displays supported
1x DisplayPort 1.4 / HDMI™ 2.0b
1x DisplayPort 1.4
Dual-Channel LVDS 24/18 bit up to 1920 x 1200 @ 60Hz or
Embedded DisplayPort 1.3 up to 4096 x 2160 @ 60Hz and
MIPI-DSI x4 Interface up to 2560 x 1600 @ 60Hz (optional)

Network Interface

2x 10/100/1000Base-T
1x SGMII Interface on PCIE-D (optional)

Audio Interface

High Definition Audio and I2S Audio
or 2x I2S Audio

Security Device

Infineon Trusted Platform Module 2.0 (optional)

Miscellaneous

Watchdog Timer:
Initiates system reset, (programmable, 1s … 255h)
Fan Supply:
PWM Speed Control for system fan on carrier board
RTC battery:
external
System Monitoring:
Voltage, Temperature, CPU Fan, System Fan

Feature Highlights

SMARC™ 2.1 compliant

Firmware

AMI Aptio UEFI

OS Support

Windows 10 IoT Enterprise RS5 (64bit)
Windows 10 IoT Core RS5 (64bit)
Linux (Yocto Project)

Power Requirement

+5V +/-5%
+5V Standby

Environment

Temperature Range:
0° … 60°C (operating)
-25° … 85°C (storage)
-40° … 85°C (operating industrial)
Humidity:
5 … 95% (operating, non-condensing)
5 … 95% (storage, non-condensing)

Dimensions 82 x 50 mm
Certificates

UL / CE

Cooling

Heatspreader
Heatsink

Carrier

MSC SM2-MB-EP1

Order Reference - MSC SM2S-EL

Order. Description Reference Status
tbd SMARC 2.1 short size module with Intel Atom x6425RE processor (1.9GHz), Quad-Core, 12W, 8GB 3200MT/s LPDDR4, 32GB UFS, 2x GbE LAN, 2x USB 3.0 Host, 5x USB 2.0 Host, 1x USB 2.0 Host/Device, TPM, 2x CAN-FD, DP, LVDS Graphics, IUC (industrial use conditions), industrial temperature -40...+85°C MSC SM2S-EL-x6425RE- 001 ES OR
PV = Preferred variant; OR = on Request (in OEM quantities only)
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