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Product Highlights

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Avnet Silica product highlights

Below please find all current Avnet Silica featured Product Highlights from our leading-edge manufacturers.

Avnet Silica & Renesas

HoriZone RA

Powered by Renesas RA MCU Family for secure IOT endpoints and edge devices, The HoriZone kit is a fully integrated solution to bring sensor data into Avnet´s IOTConnect® Cloud Platform based Microsoft® Azure cloud.



High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1 MByte Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, external memory interface, SMPS, subset of peripherals including a Crypto accelerator.


High-power Gallium Nitride FETs

Offering high power performance and high-frequency switching, the design and structure of Nexperia's normally-off GaN FET products ensure standard, low-cost gate drivers can be used in your design.

Prod Renesas RA MCU Family (RM)

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RA MCU Family

The Renesas RA Family is a new 32-bit MCU family built on the Arm® Cortex®-M core architecture. The Renesas RA Family meets the scalability, power consumption and performance needs of nearly any embedded systems end-product.



The E522.48 is a multi-channel PWM driver for e.g. light application. It provides 16 current sinks with integrated 10bit PWM generator for each channel. Each of the drivers can digitally be configured to drive up to 100mA with a selectable slew rate.

Prod AVS Lora miniPOC Kit (RM)

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Avnet Silica

miniPOC Kit featuring LoRa

Ideal for developing cloud-based condition monitoring, predictive maintenance and device management, the kit comprises all the necessary elements to take customer IoT solutions from the edge to the cloud.

Prod ST Industrial Solutions (RM)

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STMicroelectronics & Avnet Silica

Solutions for Industrial

STMicroelectronics and Avnet Silica make it possible for you to collate and analyze data across machines to make your processes faster and more efficient.

Nordic Semiconductor


The nRF5340 SoC supports an extensive range of wireless protocols. It supports Bluetooth Low Energy, and is capable of all AoA and AoD roles in Bluetooth 5.1 Direction Finding, in addition to all Bluetooth 5 features, including Long Range.


Logic ICs portfolio

A longevity program for long-term production support commitment and an industry-leading AEC-Q100 certified portfolio (>>1.000 types) makes Nexperia the WW #1 Logic supplier to the automotive market by volume and value.​

Prod Maxim Microcontrollers (RM)

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Maxim Integrated

MAX32670 - High Reliability, Ultra-Low Power Microcontroller

Maxim Integrated’s 32-bit microcontrollers provide the cornerstone for building robust devices in the Internet of Things (IoT) age.

Xilinx & Avnet Silica

Automotive Solutions

Electrification, infotainment and advanced driver-assistance systems (ADAS) are changing our conception of what automobiles can be, but the technological complexity required to successfully implement these advances can hinder real progress.

Prod Maxim Himalaya uSLIC power modules (RM)

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Maxim Integrated

Himalaya uSLIC Power Modules

Smallest packages available, while accepting a wide input voltage from 4.0V to 60V - new modules available.

STMicroelectornics STM32L4+ chip image


RA6M4 Group

RA6M4 is suitable for IoT application requiring strong Security, rich connectivity, large embedded RAM with parity/ECC and low power consumption.

Avnet Silica

Artificial Intelligence & Machine Learning

Avnet Silica focuses on different machine learning technology areas and provides state-of-the-art machine learning solutions close to end customer applications in order to simplify the deployment of customer solutions in different key markets.


RE Family

The RE Family based on Renesas' innovative SOTB™ process technology realizes ultra-low current consumption in both active and standby mode and fast operation at low operation voltage.

Maxim Integrated & Avnet Silica

Essential Analog

In order to keep up with the steadily rising demands of both consumer and industrial electronics, Maxim delivers a broad range of rugged and reliable analog circuits to accommodate the future of wireless, wearable and microprocessor applications.